The Copper Nanowires B2 are one-dimensional copper nanomaterials engineered for conductive and multifunctional material systems. With an average diameter of ~75 nm and a length of ~5 µm, they combine nanoscale dimensions with an elongated structure that promotes wire-to-wire contact and the formation of interconnected electrical and thermal pathways. Supplied as a reddish-brown wet powder, the Copper Nanowires B2 offer flexible handling and integration into compatible coatings, polymers, adhesives, inks, ceramics, and composite matrices. Their dimensional profile provides a balance of conductivity, network formation, and processability across a broad range of research and industrial workflows. This versatile material is suitable for conductive and antistatic systems, functional coatings, flexible and printed electronics, energy-device components, EMI shielding, thermal management, and electrically active composites.
Catalog Number: NovaWire-Cu-B2-IND
Diameter: ~75 nm
Length: ~ 5 µm
Appearance: reddish-brown wet powder
KEY FEATURES
- Defined wire dimensions: The ~75 nm diameter and ~5 µm length support conductive pathway formation while remaining suitable for a range of processing methods.
- Wet-powder format: Facilitates incorporation into compatible liquid formulations, coatings, inks, binders, and composite systems.
- Conductive pathway development: The elongated morphology promotes interparticle contact for electrical and thermal transport.
- Formulation flexibility: Suitable for dispersion, blending, coating, printing, and composite preparation.
- Broad material compatibility: May be evaluated with polymers, ceramics, adhesives, paints, coatings, and other host matrices.
APPLICATIONS
The Cu Nanowires B2 are suitable for research and development in:
- Building blocks for flexible conductive networks in films used for displays, touchscreens, OLEDs, solar cells, touch sensors, electronic paper, and smart windows.
- Conductive additives for improving electrical transport in batteries, fuel cells, and supercapacitors.
- Network-forming additives for developing three-dimensional conductive pathways in polymer and ceramic composites for ESD protection.
- Conductive additives for flexible three-dimensional networks in EMI-shielding gaskets and composite materials.
- Functional additives for conductive paints, coatings, adhesives, and inks.
SDS
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