The Silver Nanowires B45 (45nm×10µm) is a fine-diameter wet powder form of silver nanowires designed for use as a conductive additive in nanocomposite and formulation development. These Ag nanowires can be redispersed, blended, or compounded with polymer matrices such as epoxy, resin, and elastomer systems. With an average diameter of ~45nm and an average length of ~10µm, these Ag nanowires provide a high-aspect-ratio metallic structure that forms efficient electrical and thermal pathways within composite materials. The wet powder format is useful for formulation work where a concentrated Ag nanowire additive is preferred over a dilute dispersion. This product is suitable for conductive adhesives, conductive pastes, polymer nanocomposites, thermally conductive composites, EMI shielding materials, printable conductive formulations, flexible circuitry, and other applications requiring fine Ag nanowire additives.
Catalog Number: NovaWire-Ag-B45
Average Diameter: ~45nm
Average Length: ~10µm
Appearance: gray wet powder
Novarials is offering this product at kilogram scale for industry users. Please contact info@novarials.com for more information.
APPLICATIONS
The Silver Nanowires B45 can be used in the following applications:
- Fine conductive adhesive and paste formulations for electronic assembly, conductive bonding, interconnects, and joining applications.
- Redispersible Ag nanowire additives for developing customized conductive inks, pastes, coatings, and printable formulations.
- Polymer nanocomposites based on epoxy, resin, elastomer, silicone, thermoplastic, and other binder systems.
- Flexible conductive coatings and films on polymer substrates, elastomers, and functional surfaces.
- Thermally conductive composite materials where fine Ag nanowire networks form heat-transfer pathways within polymer matrices.
- EMI shielding coatings and composite films requiring conductive network formation at low filler loading.
- Flexible circuitry and soft electronic materials where fine Ag nanowires are incorporated into polymer-based conductive structures.
- Formulation research involving wet powder redispersion, filler loading, dispersion stability, percolation behavior, and electrical or thermal conductivity optimization.
SDS
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